Microsystems Packaging Research Center

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UPCOMING EVENTS

Visit the PRC at ECTC May 27-30, 2008 in Buena Vista, Florida

3D All Silicon System Module (3DASSM) - two upcoming workshops:Tokyo, July 9, 2008 | (Registration available soon.) and Seoul, July 11, 2008 | Register Korea.
Read Advanced Packaging article on 3DASSM.

PRC Industry Week
Sept 15-19, 2008
Mark it on your calendar!

First Module and Substrate Warpage (MSW) consortium workshop at Georgia Tech - Sept. 2008 | Register

Visitor Travel Info

RECENT EVENTS

NanoPack Industry Consortium Workshop - April 15, 2008. Final Agenda

PRC Industry Week
Held March 10-14, 2008
Read article

PUBLICATIONS

Read Newsletter | Subscribe

Consortia Brochures

Books

First textbook on SOP: "Introduction to System -on-Package (SOP)" to be published May '08.

Power Integrity Modeling Book by Prof. Madhavan Swaminathan and Dr. Ege Engin

"Fundamentals of Microsystems Packaging" - McGraw-Hill: First textbook on the entitled subject.
NOTE: Professors using "Fundamentals of Microsystems Packaging" can order the companion Homework Solutions CD.

Magazine Articles

The 3DASSM Consortium: An Industry/Academia Collaboration - Advanced Packaging, March 2008

Moving Next-Generation Electronics beyond Moore’s Law - by Prof. Rao Tummala, GT's Research Horizons.

“Moore’s Law Meets Its Match" by Prof. Rao Tummala, June '06 IEEE Spectrum.

RESEARCH

Mixed Signal Design & Tools

Embedded Actives & Passives

Next Generation Thermal Interface Materials

Electrical Test & Fault Tolerance

Nano Packaging, Components & Systems

3D All Silicon System Module

EDUCATION

Courses

ECE 4460 - Introduction to Electronic Systems Packaging

ECE 8803 - Special Topics Course Power Integrity Modeling and Design

STUDENTS

PRC Student Council

Full-time Jobs & Internships

NEW PEOPLE AT PRC

Ritwik Chatterjee - Associate Director, Silicon Systems Research

Andy Seo - Software Research Engineer

Nitesh Kumbhat - Research Engineer

Pradeep Dixit - Post Doctoral Fellow

INDUSTRY COLLABORATION

Modes of Participation

MEMBERSHIP PROGRAMS

INDUSTRY-ACADEMIA CONSORTIA DEVELOPMENT

Professor Rao R. Tummala, Director Packaging Reserach Center

Welcome to the
Georgia Tech Microsystems
Packaging Research Center

Prof. Rao R. Tummala, Founding Director

PRC Vision: Second Law of Electronics by System-On-Package (SOP)
Unlike Moore 's Law, the first law of electronics, which integrates at IC level, PRC's vision of SOP, System-On-Package (or module) is the Second Law of Electronics for System Integration. SOP is a highly miniaturized system technology combining computing, communication, consumer, and bio-electronic functions in a single package or module. It accomplishes this miniaturization by package integration of system-level components at microscale in the short term and nanoscale in the long term.

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Applications of SOP
Digital convergence, consumer electronics, 3G and beyond communications, health care, safety, and security.

Research Areas of SOP
Mixed signal design, test, materials, processes, assembly, thermal and reliability.

Education in SOP
Undergraduate and graduate courses, curricula, textbooks, research and degrees at BS, MS and Ph.D. levels.

Industry Collaborations in SOP
More than 70 companies collaborate from US, Europe, Japan, Korea, India and Singapore.

Infrastructure in SOP
$50 M state-of-the-art facilities in design, fabrication, assembly, test and reliability.

Faculty and Students
20 faculty and more than 100 graduates and undergraduate students from ECE, MSE , ME and ChE.

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