"Power
Integrity Modeling and Design for Semiconductors and Systems"
The First Book on Power Integrity Modeling!
Madhavan Swaminathan • Ege Engin
FOR MORE INFORMATION PLEASE VISIT: www.prenhallprofessional.com/title/0136152066
Available
wherever technical books are sold.
ISBN:
0_13_615206_6
INTRODUCTION Transistor circuits require a power supply to function. The noise on the power supply can affect the performance of the transistor circuits. Any system consists of the semiconductor Integrated Circuits (IC) and interconnects that connect the power supply to the transistor circuits. The focus of this book is on the design and modeling of interconnects such that noise on the power supply can be minimized. The focus is on the semiconductor package and system rather than on just the IC. The book consists of five chapters. The basic concepts related to power distribution design are discussed in Chapter 1. It consists of a simple representation of transistors as switches, analytical equations for estimating noise, components of a power distribution network, analysis of these components and the differentiation between core and I/O circuits for power distribution. A methodology for modeling such networks is also discussed in Chapter 1. The modeling aspects of noise are covered in Chapters 2, 3, and 4 which includes different methods for plane modeling, comparison between these methods, inclusion of transmission lines, and interpolation based modeling. In Chapter 5, applications related to design methodologies, material characterization using power distribution structures, new technologies, and system design have been covered using real world examples. The book is filled with examples that range from the very simple (such as using analytical equations to compute power supply noise), to moderate (such as capturing physical electromagnetic effects in multi-layered structures), to complex (such as system level applications). These examples are supported by software that will be made available via the publisher's website upon publication.
ABOUT THE AUTHORS
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MADHAVAN
SWAMINATHAN received his MS and PhD degrees in electrical engineering
from Syracuse University. He is currently the Joseph M. Pettit Professor
in Electronics in the School of Electrical and Computer Engineering
and Deputy Director of the Packaging Research Center, Georgia Tech.
He is the co-founder of Jacket Micro Devices, a company specializing
in integrated RF Modules for Wireless Applications. His work on Power
Integrity has been recognized through numerous awards by IEEE. He became
a Fellow of IEEE for his contributions on power delivery.
EGE
ENGIN received his BS and MS degrees in electrical engineering from
Middle East Technical University, Ankara, Turkey, and from University
of Paderborn, Germany. From 2001 to 2004 he was with the Fraunhofer-Institute
for Reliability and Microintegration in Berlin . During this time he
also received his PhD degree from the University of Hannover, Germany.
He is currently a Research Engineer in the School of Electrical and
Computer Engineering and an Assistant Research Director of the Packaging
Research Center at Georgia Tech. He has more than 40 publications in
journals and conferences in the areas of signal and power integrity
modeling and simulation.