Master the Revolutionary System-On-Package Technology that Places an Entire Electronic System in Your Hand!

System-On-Package (SOP) is an emerging system technology that goes beyond System-On-Chip (SOC) and System-In-Package (SIP) and forms the basis of all emerging digital convergent electronic and bio-electronic systems. Unlike SOC which integrates and miniaturizes 10% of a system, SOP miniaturizes the entire system. It does this by package integration with embedded components at micro-scale in the short term and nano-scale in the long term. Written by the well known leaders of the team at Georgia Tech that developed the technology, Introduction to System-On-Package (SOP): Miniaturization of the Entire System explains the basics of SOP design, all the system technologies and applications. This first-ever book to SOP shows designers how this revolutionary new packaging technology—which is cheaper to design and manufacture, and faster to market than traditional packaging and assembly—answers a wide range of pressing digital convergence challenges.

Introduction to System-On-Package (SOP): Miniaturization of the Entire System defines what SOP is and how it differs from the other dominant System-On-Chip and System-In-Package technologies. The book describes how SOP-based mixed signal systems could be designed, fabricated, tested and assembled with digital, RF, optoelectronic and bio-sensor functions. Filled with over 200 helpful illustrations, this landmark resource features:

• The latest methodologies for convergent systems design
• Advanced multi-functional materials and their chemical process integration
• Expert guidance on applications in computing, communication, consumer and bio-medical
• A lucid account of SOP with electrical test, wafer level assembly and thermal management
• New information on integration of RF, optical, and digital functions.

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About the Authors

Rao R. Tummala

Rao Tummala is a Petit Endowed Chair Professor and Founding Director of the Micro and Nano-systems Packaging Research Center at Georgia Tech. He was a former IBM Fellow, a former President of IEEE CPMT and IMAPS Societies, an IEEE Fellow, and a member of the National Academy of Engineering in US and India. Dr. Tummala received many industry, academic and professional society awards, including IndustryWeek’s award as one of the 50 Stars in the U.S. He is the author of 5 books, 425 technical papers and 72 patents and inventions.

Madhavan Swaminathan

Madhavan Swaminathan is Joseph M. Pettit Professor in Electronics in the School of Electrical and Computer Engineering, and Deputy Director of the Microsystems Packaging Research Center, Georgia Tech. He is the co-founder of Jacket Micro Devices, a leader in integrated RF modules and substrates for wireless applications and SoPWorX, a company specializing in EDA software for SOP applications. Prior to joining Georgia Tech, he was with IBM working on the packaging of supercomputers. He has written more than three hundred publications, holds fifteen patents and has been honored as an IEEE Fellow.