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3D All Silicon Systems Module (3DASSM)
An Industry-Academia Consortium

 

Leaders: Ritwik Chatterjee, Profs. Rao Tummala, Madhavan Swaminathan, C. P. Wong, Suresh Sitaraman

Goal: Si-based, Ultra Miniaturized Digital & RF Convergence

Launch Date: Fall 2008

Contact: Dr. Ritwik Chatterjee, ritwik.chatterjee@ece.gatech.edu

Research Projects

1. Read Advanced Packaging (3/08) article, "The 3DASSM Consortium: An Industry/Academia Collaboration"

   3D All Silicon System Module Design
   • Signal & power integrity & EMI
   • Inter-stack coupling, TSV shielding
   • RF/analog circuit and low power Designs
   • Yield and test issues, Embedded BIST in Si substrate
     
2. Si Substrate with Multilayer Wiring and Shielded TSV
• High density, fine pitch multilayer build up
• Si Core with optimized TSV materials & processes
3. Low Cost TSV
   • Lower cost TSV formation filling, and reliability
   • Bonding and assembly of 3D stack
4. Thin Film Active and Passive Components
• Ultra high Q RF inductors, High k, high µ materials
• Miniaturized High Efficiency Silicon Antennas
• Reconfigurable micro-antenna arrays in 3D wafer RDL
• Low loss and high K RF capacitors
• Embedded and transferable actives
5. IC to Si Substrate-Board Interconnections and Reliability
• Low temperature Cu-Cu & Cu-Sn bonding
• Reactive thin film, metal-based bonding
• Wafer level underfills for adhesion, stress relief & gap fill
• Flex SMT interconnections between Si substrate - PWB Board
• Interfaces, adhesion, and reliability
• Solder filled adhesive interconnect
6. Integration
   • Design
   • Silicon substrate
   • 3D die stacking

Academic Partners

Fraunhofer IZM - Germany

KAIST - South Korea

Participating Companies

• Attendees at first workshop (March 10-11, 2008):
  
  Air Products and Chemicals • ASE Group • ASM Technology • Atotech USA • AVX • Bosch GmbH • Brewer Science • CEA LETI Minatec • Endicott Interconnect Technologies • ETRI • EV Group • Fairchild Semiconductor • Fraunhofer IZM • Fujitsu Microelectronics America • Hynix Semiconductor • Ibiden • IBM • Indium Corporation of America • Intel • Jacket Micro Devices • KAIST • Kawasaki Microelectronics America • KEMET Electronics • Maxtek • Medtronic • Micron Technology • Murata Electronics • Nagase America Corp. • NASA Marshall Space Flight Center • NGK-NTK • nGiMat Co. • Nitto Americas • NXP Semiconductors • Panasonic • Qualcomm • Rambus Inc. • Rockwell Collins • Rohm & Haas • Rogers Corporation • SAMEER • Samsung Electronics • Scientific-Atlanta/Cisco • Sematech • Shanta Systems, Inc. • Shinko Electric Industries • Sonoscan • STATSChipPAC • ST Microelectronics • Surface Technology Systems (STS) • TechSearch International • Tektronix • Texas Instruments • U.S. Dept. of Defense • Vicor Corporation