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Ultra-miniaturized Bioelectronics with System-On-Package (BioSOP)
An Industry-Academia Consortium
Goal: Ultra-miniaturized bioelectronics with SOP
Leaders: Professor Maysam Ghovanloo, Dr. Raj Pulugurtha; Dr. Janagama Goud
Support Team: Dr. Janagama Goud, Venky Sundaram, Profs Z. L. Wang, Meilin Liu, C. P. Wong and Rao Tummala
First Workshop Date: September 18-19, 2008 | Agenda and Registration
Launch Date: To be determined.
Contact: Dr. Raj Pulugurtha, raj@ece.gatech.edu
Overview
By 2017, 20% of the U.S. GDP is spent on healthcare and about 80% of the U.S. healthcare is spent on diagnosing, monitoring and curing chronic diseases. Implantable medical electronics provide solutions for several chronic diseases related to heart and nervous system disorders.
Current biomedical implants consist of a combination of integrated and discrete components that are assembled together on a bulky substrate leading to large and high power consuming devices with inadequate performance that are highly invasive if placed inside the human body. Bio-implantable systems, so far, have relied on conventional packaging techniques that do not take advantage of the emerging package level system integration trends.
The Microsystems Packaging Research Center at Georgia Tech (PRC) is pioneering the “System-On-Package” (SOP) paradigm to enable ultra-miniaturized, low cost and low power bioelectronic and bio-sensing systems. In the SOP concept, devices, packages and substrates are all miniaturized and integrated into a single system within the package. SOP accomplishes this by its vision of design and functional optimization between IC and package, embedded thin film active and passive system components in a high density bio-compatible package and with thin film bonding between these devices. SOP can thus address the bioelectronic system packaging challenges leading to the low-cost, low-power, ultra-miniaturized bioelectronic systems of the future.
The PRC is organizing a pre-competitive strategic research consortium on Bioelectronic System-On-Package (BioSOP) with a focused team of academic and industry leaders. The BioSOP consortium proposes to go beyond the R&D and will include 5 major thrusts:
Research Projects
(1) Bioelectronic Systems and Design
- ASIC and biosensor interface design
- Power and data telemetry design
- RF package design for wireless interfaces
- Stimulators and recording
(2) Bio and Chemical Sensors
- Nanobiosensors for health diagnoses
- Wireless environmental and chemical sensors
(3) Bio-compatible Substrate with Hermetic Sealing and Microelectrodes
- High density biocompatible substrates
- Hermetic packaging of thin ICs
- Biocompatible flex packaging
- Hermetic neurostimulators
- Superhydrophobic biocompatible surfaces
(4) Nanobatteries
- Thin film high energy density batteries
- Nanobiotemplating high surface electrodes
(5) Embedded Thin ICs and Passives
- Compact high value inductors
- Nano capacitors
- Embedded thin ICs with thin film interconnections
Potential Partners
Medtronic
Texas Instruments
Mayo Clinic
Boston Scientific
