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Thermal Interface Materials (TIM)
An Industry-Academia Consortium in Partnership with State University of New York - Binghamton

Leaders: Profs. Yogendra Joshi, ME (lead), C.P. Wong, Sam Graham, Rao Tummala, Suresh Sitaraman, Jianmin Qu, Dr. Raj Pulugurtha (Georgia Tech); Bahgat Sammakia (SUNY-Binghamton)

Goal: 10X Improvement in R_TIM

Launched: September 1, 2007 | Kick-off Meeting: September 21, 2007 (Kick-Off Meeting Details)

Contact: Dr. Chong Yoon, cyoon@ece.gatech.edu

Proposed Projects

• Development of Aligned Carbon Nanotube Films For Thermal Interface Material Applications
• Assembly and Testbed Research with Metal and Metal Composite TIM
• Thermal and Thermomechanical Modeling and Characterization of TIMs and Their Interfaces
• Design for Reliability of Thermal Interface Materials

Participating Companies (Signed up or in signing stage - Last Update September 25, 2007)

• Bosch
• Celestica
• Chomerics
• Dow Corning
• Honeywell
• Hynix
• Lord Corporation
• Maxtek
• Rohm and Haas