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Endless demands for digital convergence by miniaturization, increased functionality, better performance and low cost in both mobile and desktop systems are driving the need for new and unique solutions in system integration. The primary approach, so far, has been the stacking of bare and packaged ICs in SIP technology. SIP technology is a module technology and, thus, a small part of the end product systems. True miniaturization of products requires, not only at-IC and at-module levels, but also at-system level—the latter to be accomplished by embedded actives and passives in package-sized boards. While some of this research and development has been in process, its ultimate potential has not been exploited.

GT PRC proposes a global industry-academia consortium in new and advanced embedded actives and passives in its SOP technology platform to serve the emerging digital convergence needs of mobile and desktop applications.

Topics

• Industry needs for EMAP
• EMAP technologies to date
• PRC’s capabilities in EMAP
  • Electrical design
  • Embedded thin film components
  • Thermal management
  • System integration
  • Quality and reliability
  • New approaches for embedded actives and passives for mobile and digital applications
  • Proposed EMAP strategy

Who Should Join?

Senior engineers and managers from companies that are involved in these areas are encouraged to join the EMAP consortium:

• Cell Phone and Mobile Products
• Semiconductors
• IC Packaging
• SIP
• LTCC
• Boards
• Passive Components
• Packaging Materials and Tools
• Package Assembly
• Design Tools

Agenda

Please check back soon.