|
|
||||||||||
| Georgia Tech >> College of Engineering >> ECE >> PRC | ||||||||||
| Welcome | Academics | Students | Faculty & Staff | Research | Industry Partnerships | News Archive | ||||||||||
|
|
|
The Microsystems Packaging Research Center at the Georgia Institute of Technology (PRC-GT) proposes to create an Industry-Academia collaborative consortium to address the R&D of next generation Thermal Interface Materials (TIM) with thermal resistance below 0.005 °C-cm 2/W), including materials, processes, structures and reliability characterization. While considerable improvements in TIM performance have been achieved in the past five years with the development of gels and phase change metallic alloys, further enhancements may require a systematic approach toward material selection/development, interface characterization, assembly and reliability assessment. The Georgia Tech PRC is a global academic leader working on several innovative “total system” approaches that include IC-package electrical, mechanical, and thermal co-design methodologies, thermal management and characterization techniques, new and advanced chip-to-substrate interconnects, embedded passives and actives, new substrate materials and interfaces, advanced assembly processes, and reliability assessment techniques.
Contacts Prof. Rao Tummala Prof. Yogendra Joshi
|
Agenda September 15 (Monday), 2008 Registration: 11:30 AM~12 Noon, MaRC Atrium Lunch: 12:00~1:00 PM, MaRC Atrium 1:00~1:20 PM: Welcome and Introduction—Prof. Yogendra Joshi 1:20~4:45 PM SESSION 1: TIM Research Projects Review—Chair, Profs. Bahgat Sammakia and Jianmin Qu Task 1: TIM Materials and Interfaces
Task 2 and 3: TIM Assembly and Bonding, and Characterization of TIM
Coffee Break: 2:35~3:05 PM
Task 4: TIM Reliability:
4:45~5:30 PM: SESSION 2: Year 2 plans and Wrap-up Discussion - Chair, Prof. Yogendra Joshi Industry Dinner: 6:30PM~8:30 PM, Georgia Tech Hotel General PRC Contact Information PHONE: 404-894-9097 POSTAL
ADDRESS: |