Visitor Travel Info

The Microsystems Packaging Research Center at the Georgia Institute of Technology (PRC-GT) proposes to create an Industry-Academia collaborative consortium to address the R&D of next generation Thermal Interface Materials (TIM) with thermal resistance below 0.005 °C-cm 2/W), including materials, processes, structures and reliability characterization.

While considerable improvements in TIM performance have been achieved in the past five years with the development of gels and phase change metallic alloys, further enhancements may require a systematic approach toward material selection/development, interface characterization, assembly and reliability assessment.

The Georgia Tech PRC is a global academic leader working on several innovative “total system” approaches that include IC-package electrical, mechanical, and thermal co-design methodologies, thermal management and characterization techniques, new and advanced chip-to-substrate interconnects, embedded passives and actives, new substrate materials and interfaces, advanced assembly processes, and reliability assessment techniques.

Agenda

Download PDF agenda

April 16 (Thursday), 2009

11:00 AM - 11:10 AM
Welcome and Introduction- Prof. Joshi

11:10 AM - 11:50 AM
The Development of Aligned Carbon Nanotube Films For Thermal Interface Material Applications- Prof. C.P. Wong, Graham (20min)

11:50 AM - 12:10 PM
Assembly and Testbed Research with Metal and Metal Composite TIM- Dr. Raj

12:10 PM - 01:10 PM
Thermal and Thermo-mechanical Modeling and Characterization of TIMs and Their Interfaces- Prof. Joshi (20min) / Prof. Sammakia (20min) / Prof. Qu (20min)

01:10 PM - 01:30 PM
Design for Reliability of Thermal Interface Materials- Prof. Sitaraman

01:30 PM - 01:45 PM
Wrap-up Discussion- Prof. Joshi