Membership & Partnership Programs

Overview | Involvement Levels & Benefits | Technology Focus | PRC's Affiliates

Introduction to PRC | PRC Bylaws | PRC Membership Agreement

Packaging Research Center 813 Ferst Street, Room 351 Atlanta, GA 30332-0560

Phone: 404-894-5233 FAX: 404-894-3842 E-mail: prcinfo@ece.gatech.edu

Overview

The Packaging Research Center (PRC), at the Manufacturing Research Center on the Georgia Tech campus, was established in 1994 as a U.S. National Science Foundation Engineering Research Center. The PRC is the largest academic center dedicated to System-On-Package (SOP) microsystems packaging technologies.

This information outlines the PRC’s Membership and Partnership programs and their options, benefits, and costs.

Participation with the PRC consists mainly of the following:

• Leading-edge Research
• Access to Complete System Fabrication Facility
• Supply Chain Connectivity
• Student Recruitment

Involvement Levels & Benefits Research Donorship Student Fellowship (unrestricted donations) Infrastructure Partnership (in kind donations) Basic Partnership ($10K) Benefits: Connectivity & Awareness Pre-Competitive Research Supply Chain Partnership ($25K) Project Membership ($60K) Program Member (($60K and up) Benefits: Non-exclusive foreground IP Shared research results Project mentoring Competitive Research Company-Sponsored Contracts ($60K and up) Benefits: Exclusive foreground IP Exclusive research results Direct involvement	Technology Focus: SOP Mixed Signal Design Tools, Modeling and Simulations Nano Packaging Materials Thin Film Embedded Components: capacitors, resistors, inductors Embedded RF Components and MEMS Embedded Chip-to-Chip Optoelectronics Embedded Active Devices Biosensors and Interface Electronics Ultra High Density and Thin Core / Coreless Substrates Ultra Fine Pitch Solder and Non-solder Interconnections Wafer-Package Intergration 3D SOP Thermal Interface Materials Thermal Management Solutions Reliability Modeling and Prediction Electrical Test and Fault Tolerance SOP Test Vehicles	HIGHLY INTEGRATED MIXED SIGNAL PACKAGING ENABLING CONVERGENT SYSTEMS TECHNOLOGIES Computing / Internet Digital Audio Digital Imaging / Video Cellular / Wireless GPS / Satellite Sensors

PRC MEMBERS & AFFILIATIONS (Past & Present)

Industry

AMD • Agilent • Air Product & Chem. • Alcatel USA • Altera Corporation • AMAT • AMP/Tyco Int’l. • Analog Devices • Ansoft Corporation • Anvik • Applied Materials • Applied Simulation • Ardex • Asahi Glass • Asymtek • AT&S • AT&T • Atotech-Berlin • AVX Corporation • BAE Systems • Batelle-Pacific • BellSouth • Boeing • Bosch • Bourns • BPW • BTU • Cadence Design • Cascade Microtech • Chemfirst EKC • Chemical Products • Chrysler • Circuit Tech. • Cisco • Compaq Corp. • Contec • Cookson America • Cree • CYC Enterprises • Delco • Delphi Automotive • Dexter Research • Dickerson Vision • Dow Corning • Draper Laboratory • DuPont EKC Technology • Emerg. Tech. (ETS) • Emerson & Cumm • Endicott (EIT) • Engent • EPCOS • Ericcson • Flipchip Tech. • General Electric • Goodrich • Gould Electronics • Hadco • Halliburton Energy • Harima Chemicals • Harris Corporation • Hewlett Packard • Hitachi Chemical • Honeywell Int’l • Hughes Research • Ibiden • Indium Corporation • Industrial Logic Corp. • Infineon • Inframat Corporation • Inplane Photonics • Intel Corp. • IBM • Irvine Sensors • Jacket Micro Devices • JDS Uniphase • Johnson Matthey • Kimberly Clark • Kodak • KYMA • Kyocera • Lambda Electronics • Lambda Technologies • LG Electronics • Lockheed Martin • Loctite • Logic Vision • Lord Corporation • Lucent Technologies • Matsushita Electric • Medtronic • Micro Substrates • Micro-ASI • MicroCoating (MCT) • MicroModule Systems • Micron Technologies • Microsoft • Motorola • Nanonexus • National Semiconductor • National Starch • NCR • NEC-Japan • Nitronex • Nokia • Northrop-Grumman • NTK/NGK Sparkplug • NXP • Oak-Mitsui • Panasonic • Panda Project • Polaroid • Polymer Aging • Polymer Solutions • Power Delivery Net. • Pratt & Whitney • Promerus • QualComm • Quellan • Rambus • Raytheon • Research Devices • Rockwell Collins • Rogers • Rohm & Haas • R-Soft • Samsung Electronics • Samsung Techwin • Savantage Corp. • Schlumberger • Semco • Shipley • Siemens • SkyWorks • Sonoscan • Sony • Specialty Coating • SRC • Starfire Systems • Sun Microsystems • Tellabs • Tessera Technologies • Texas Instruments • Toray • TriQuint Semicon. • Visteon • VT Silicon • Xerox-PARC • Zenith Electronics

Government

AFOSR • DARPA • DOE • EPA • Jet Propulsion Lab-CA • NASA • NAVY • NIH • NIST • NSA/DOD • NSF • Sandia National Labs • Sameer • Oak Ridge Nat. Labs • U.S. Army/AMCOM

Standards Organizations

IEEE • IMAPS • iNEMI • MARCO

Academia

Arizona State University • Auburn University • Budapest University • Calif. Inst. of Technology • Carnegie Mellon • Chalmers University • Clemson University • SUNY • Binghamton • Fraunhofer Univ. • IME-Sing. (A*Star) • Indian Institute • KETI • Polytechnic di Torino • Rutgers University • University of Arkansas • University of Denver • University of Illinois • University of Maryland • University of Michigan • University of Minn. • Univ. NY-Binghamton • Univ. of Texas-Austin • Univ. of Washington