Message from the Director

The Packaging Research Center at the Georgia Institute of Technology is a global Engineering Research Center pioneering "Systems-On-A-Package" (SOP) Research, Education and Industry Collaboration funded by the National Science Foundation, the State of Georgia, in partnership with the electronics industry.

The microelectronics and systems industry is expected to grow over the next ten years from its current level of $250 billion to $600 billion. The PRC recognizes that new frontiers in both research and education must be explored and transferred to industry to support this unprecedented growth.

In research, the implementation of System-on-a-Package (SOP) will revolutionize microelectronics system technologies in the third millennium, enabling ten-fold improvements in size, cost, reliability and performance of microelectronics systems.

In education, a globally-competitive work force with theoretical, as well as hands-on, education must be trained. In addition to the areas of science, engineering, microelectronics and packaging, this training must encompass the broader areas of business, economics, foreign culture and languages.

Our vision at the PRC is to pioneer SOP developments on both these fronts which will benefit the microelectronics industry today and in the future.